Government Sets Goal to Manufacture 3-Nanometre Chips Domestically by 2032
Union IT and Electronics Minister Ashwini Vaishnaw announced that India aims to manufacture 3-nanometre (3nm) chips domestically by 2032. While India already has a strong presence in chip design, the focus will now shift to mastering the complex manufacturing processes required for these advanced components. The government plans to achieve technological self-reliance under the second phase of the Design-Linked Incentive (DLI) Scheme, aiming for domestic control of 70–75% of chip technologies.
The initiative will concentrate on six core chip categories—compute, radio frequency (RF), networking, power, sensors, and memory—critical to modern electronic devices from smartphones to automotive systems. An intermediate milestone is set for 2029, by which India expects robust capabilities in designing and manufacturing chips to meet the majority of national requirements.
Vaishnaw emphasized collaboration between academia and industry to drive innovation in these six categories, creating a self-sufficient ecosystem for the country. By combining industry expertise with academic research, India aims to transition from a consumer to a global producer of high-end semiconductor technology.
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