Intel, 3DGS to Invest $3.3 Billion in Odisha Semiconductor Substrate Plant

U.S.-based chipmaker Intel and 3DGS Inc. USA will invest approximately $3.3 billion to establish a semiconductor substrate manufacturing facility in Odisha, marking a significant boost to India’s ambitions of becoming a global semiconductor manufacturing hub. The Indian government announced the project on Friday, highlighting its strategic importance in strengthening the country’s electronics and chip supply chain.

The proposed plant will be located in the Bhubaneswar-Khurda region and is expected to be developed over the next five to six years. Once operational, the facility will focus on producing advanced packaging glass core substrates, high-density interconnect substrates, and other semiconductor-related technologies. The project is also expected to generate more than 1,800 direct high-skilled jobs, contributing to the region’s industrial and economic growth.

The investment aligns with Prime Minister Narendra Modi’s push to expand domestic manufacturing and reduce dependence on imports in critical technology sectors. Backed by billions of dollars in government incentives for semiconductor and electronics production, the new facility is expected to strengthen India’s position in the global semiconductor ecosystem and attract further investments in the sector.

Pic Courtesy: google/ images are subject to copyright